Microscopic water droplets cool the heating processor from the inside

Every year, cooling systems for electronic devices are becoming more efficient, which opens up opportunities for scientists to create more powerful and complex chips. As part of the ICECool research program organized by DARPA, the military corporation Lockheed Martin is developing a new technology for cooling the inside of powerful microchips using microscopic water droplets.

As you know, electronic devices of the past were distinguished by their large size, including due to the bulky cooling system. The modern element base and, above all, the chips are literally "shallow" before our very eyes, which requires completely new approaches to the creation of new generation cooling systems.

According to ICECool Principal Investigator John Dietry, one of the biggest challenges so far is heat management. If it is solved, it means that less material will be required to create an electronic device, and, consequently, the entire system will be more compact and efficient.

The microfluidic cooling system proposed by Lockheed is based on microfluidics, by integrating microscopic water droplets directly into the chip.

Currently, such a system is being created for a transmitting antenna as a prototype for further development of the technology. In addition, the company is already working with chip maker Qorvo to integrate the cooling system into gallium nitride and gallium arsenide chips.